PRODESO HEAT GRIP SYSTEM FEATURES IMPROVED MECHANICAL BOND BETWEEN THINSET AND MEMBRANE
Progress Profiles’ PRODESO® HEAT GRIP SYSTEM improves the already superior performance of the PRODESO® HEAT SYSTEM. PRODESO® HEAT GRIP SYSTEM features specially-engineered designed cavities that drastically improve the mechanical bond between the thin-set layer and the membrane itself. This additional bond strength is extremely desirable in today’s installations of large-format tile, slabs and mosaics in both natural stone and ceramic tile. The new and improved PRODESO HEAT GRIP SYSTEM design also includes wicking channels that increase the vapor management efficiency of the assembly. PRODESO HEAT GRIP can be used with both modified or unmodified thinsets.
See Progress Profiles and the PRODESO HEAT GRIP SYSTEM at TISE West booth # 4907.